Semiconductor device and manufacturing method thereof for reducing the area of the memory cell region

ABSTRACT

A structure is adopted for a layout of an SRAM cell which provides a local wiring  3   a  between a gate  2   a  and gate  2   b  and connects an active region  1   a  and an active region  1   b . This eliminates the necessity for providing a contact between the gate  2   a  and the gate  2   b . Therefore, it is possible to reduce the size of a memory cell region C in a short side direction. Furthermore, a structure whereby a left end of a gate  2   c  is retreated from the gate  2   a  and a local wiring  3   b  which connects the active region  1   b  and gate  2   c  disposed in a diagonal direction is adopted. This allows the gate  2   a  to be shifted toward the center of the memory cell region C.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device and manufacturing method thereof, and more particularly, to the structure of an SRAM and manufacturing method thereof.

2. Background Art

With an increase in the degree of integration of a semiconductor device, the size of a semiconductor memory represented by SRAM (Static Random Access Memory) or the like is becoming smaller. In line with this, the size and wiring pitch of elements mounted in the semiconductor memory are becoming smaller.

In Japanese Unexamined Patent Publication No. 10-178110, a layout for reducing a cell area of an SRAM made up of CMOS devices whose one bit consists of 6 transistors is disclosed.

FIG. 17 shows a general layout of the above described SRAM. This figure shows a memory corresponding to one bit of the SRAM. Each element is disposed so as to be symmetric with respect to a center point E.

Active regions 1 a to 1 d are provided inside a memory cell region C. A gate 2 a is disposed so as to cross the active region 1 a and a gate 2 b is disposed so as to cross the active regions 1 a, 1 b. A shared contact (hereinafter referred to as “SC”) 3 is provided so as to connect the active region 1 b and gate 2 c. The gate 2 a is provided with a contact 4 a. The active region 1 a is provided with contacts 4 b, 4 c and 4 d. The active region 1 b is provided with a contact 4 e. Metal wirings 5 b, 5 c, 5 d and 5 e are provided so as to cover the contacts 4 b, 4 c, 4 d and 4 e respectively. The active region 1 a is connected to the active region 1 b through the contact 4 c, metal wiring 5 b and SC3. The active region 1 b is connected to the gate 2 c through the SC3.

In the above described semiconductor device, the contact 4 c is disposed between the gate 2 a and gate 2 b. For this reason, it is difficult to shorten a distance t₁ between the gate 2 a and gate 2 b.

SUMMARY OF THE INVENTION

The present invention has been developed to solve the above-described problems, and therefore it is an object of the present invention to provide a semiconductor device and manufacturing method thereof to reduce the area of a memory cell region of a semiconductor device provided with wirings in an area between two gates in the memory cell region.

The above object is achieved by a semiconductor device that includes a first active region provided inside a memory cell region on a substrate, a second active region separated from the first active region by an element isolator, provided at a position closer to a center of the memory cell region than the first active region, a first gate electrode which crosses the first active region, a second gate electrode which is separated from the first gate electrode and crosses the first active region and the second active region, a first drain section between the first gate electrode and the second gate electrode in the first active region, a second drain section provided at the position of the same side of the first drain toward the second gate electrode in the second active region, a first wiring which connects the first drain section and the second drain section, a third gate electrode separated from the first gate electrode and the second gate electrode, an end of which is opposed to an end of the first gate electrode on the second active region side, and a second wiring which connects the second drain section and the third gate electrode, and no contact for connecting the first wiring to a wiring in a higher layer is provided between the first gate electrode and the second gate electrode.

The above object is achieved by a method of manufacturing a semiconductor device that includes steps of forming a first active region and a second active region which is separated from the first active region by an element isolator and provided at a position closer to a center of the memory cell region than the first active region, in a memory cell region on a substrate, a step of forming a first gate electrode which crosses the first active region, a second gate electrode which is separated from the first gate electrode and crosses the first active region and the second active region and a third electrode which is separated from the first gate electrode and the second gate electrode, an end of which is opposed to an end of the first gate electrode on the second active region side and retreated from the first gate electrode more than an end of the second active region opposed to the first gate electrode, a step of forming a first drain section between the first gate electrode and the second gate electrode in the first active region and a second drain section at the position of the same side of the first drain toward the second gate electrode in the second active region, a step of forming a first wiring which connects the first drain section and the second drain section, and a step of forming a second wiring which connects the second drain section and the third gate electrode.

According to the present invention, for a semiconductor device provided with wiring in an area between two gates in a memory cell region, a structure with no contacts provided for connecting the above described wiring to wirings in higher layers, and can thereby reduce the area of a memory cell.

Other features and advantages of the invention will be apparent from the following description taken in connection with the accompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1A is a plane view of the semiconductor device according to the first embodiment;

FIG. 1B is a cross sectional view along A-A′ shown in FIG. 1A;

FIG. 1C is a cross sectional view along B-B′ shown in FIG. 1A;

FIGS. 2A, 3A, 4A and 5A are plane views of the semiconductor device showing the method of manufacturing the semiconductor device according to the first embodiment;

FIGS. 2B, 3B, 4B and 5B are cross sectional views along A-A′ shown in FIGS. 2A, 3A, 4A and 5A respectively;

FIGS. 2C, 3C, 4C and 5C are cross sectional views along B-B′ shown in FIGS. 2A, 3A, 4A and 5A respectively;

FIG. 6 is a plane view of the semiconductor device according to a modification example of the first embodiment;

FIG. 7A is a plane view of the semiconductor device according to the second embodiment;

FIG. 7B is a cross sectional view along A-A′ shown in FIG. 7A;

FIG. 7C is a cross sectional view along B-B′ shown in FIG. 7A;

FIG. 8A is a plane view of the semiconductor device showing the method of manufacturing the semiconductor device according to the second embodiment;

FIG. 8B is a cross sectional view along A-A′ shown in FIG. 8A;

FIG. 8C is a cross sectional view along B-B′ shown in FIG. 8A;

FIG. 9A is a plane view of the semiconductor device according to the third embodiment;

FIG. 9B is a cross sectional view along A-A′ shown in FIG. 9A;

FIG. 9C is a cross sectional view along B-B′ shown in FIG. 9A;

FIGS. 10A, 11A and 12A are plane views of the semiconductor device showing the method of manufacturing the semiconductor device according to the third embodiment;

FIGS. 10B, 11B and 12B are cross sectional views along A-A′ shown in FIGS. 10A, 11A and 12A respectively;

FIGS. 10C, 11C and 12C are cross sectional views along B-B′ shown in FIGS. 10A, 11A and 12A respectively;

FIG. 13A is a plane view of the semiconductor device according to the fourth embodiment;

FIG. 13B is a cross sectional view along A-A′ shown in FIG. 13A;

FIG. 13C is a cross sectional view along B-B′ shown in FIG. 13A;

FIGS. 14A, 15A and 16A are plane views of the semiconductor device showing the method of manufacturing the semiconductor device according to the fourth embodiment;

FIGS. 14B, 15B and 16B are cross sectional views along A-A′ shown in FIGS. 14A, 15A and 16A respectively;

FIGS. 14C, 15C and 16C are cross sectional views along B-B′ shown in FIGS. 14A, 15A and 16A respectively; and

FIG. 17 is a plane view of the conventional semiconductor device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of the present invention will be described below referring to the drawings. In the drawings, the same or equivalent parts will be denoted by the same reference numerals, and the description thereof will be simplified or omitted.

First Embodiment

A plane view of the semiconductor device according to this embodiment is shown in FIG. 1A. This semiconductor device is a CMOS static random access memory (hereinafter referred to as “SRAM”), 1 bit of which is made up of six transistors. A 1-bit cell memory of this SRAM is disposed inside the memory cell region C. The respective elements are arranged so as to be symmetric with respect to a center point E of this region. Hereinafter, explanations of parts symmetric with respect to a point will be simplified or omitted.

The memory cell region includes an N-type channel region (hereinafter referred to as “Nch region”) where N-type transistors are arranged and P-type channel region (hereinafter referred to as “Pch region”) where P-type transistors are arranged. The Pch region is provided in the central area of the memory cell region C. The Nch regions are provided on both sides thereof. Active regions 1 a, 1 d are provided in the Nch regions while active regions 1 b, 1 c are provided in the Pch region. The active region 1 b is separated from the active region 1 a and closer to the center of the memory cell region C than the active region 1 a.

A gate 2 a is provided so as to cross the active region 1 a. The active region 1 a and gate 2 a constitute an access transistor 6. A gate 2 b is provided apart from the gate 2 a so as to cross the active region 1 a and active region 1 b. The active region 1 a and gate 2 b constitute a drive transistor 7. The active region 1 b and gate 2 b constitute a load transistor 8. A gate 2 c is provided so as to cross the active region 1 c and active region 1 d. The left end of the gate 2 c is opposed to the right end of the gate 2 a and provided at a position more retreated from the gate 2 a than the left end of the active region 1 b.

A local wiring 3 a is provided so as to connect the active region 1 a and active region 1 b. A local region 3 b is provided so as to connect the active region 1 b and gate 2 c. The local wiring 3 b forms a predetermined angle (approximately)45° with respect to the longitudinal direction of the local wiring 3 a.

A drain D₁ is provided between the gate 2 a and gate 2 b in the active region 1 a. A drain D₂ is provided at a position in the active region 1 b contacting the side of the gate 2 b on the drain D₁ side. In other words, a drain D₂ is provided at a position of the same side of the drain D₁ toward the gate 2 b. A drain D₄ is provided between the gate 2 c and gate 2 d in the active region 1 d. A drain D₃ is provided on the drain D₄ side of the gate 2 c in the active region 1 c.

A contact 4 b is provided at a position in the active region 1 a opposite the local wiring 3 a with the gate 2 a placed in between. A wiring 5 b is provided so as to cover the contact 4 b. A contact 4 d is provided at a position in the active region 1 b opposite the local wiring 3 a with the gate 2 b placed in between. A wiring 5 d is provided so as to cover the contact 4 d. A contact 4 e is provided at a position in the active region 1 b opposite the local wiring 3 a with the gate 2 b placed in between. A wiring 5 e is provided so as to cover the contact 4 e.

FIG. 1B shows a cross section along A-A′ shown in FIG. 1A. The active regions 1 a to 1 d are provided on the surface of a silicon substrate 11. The respective active regions are separated from each other through an element isolator 12. A liner film 13 made of a silicon nitride film is provided on the silicon substrate 11. A first inter-layer insulating film 14 made of a silicon oxide film is provided thereupon. Local wirings 3 a and 3 d are provided in the liner film 13 and first inter-layer insulating film 14. The local wiring 3 a connects the drain D₁ (active region 1 a) and drain D₂ (active region 1 b). The local wiring 3 d connects the drain D₃ (active region 1 c) and drain D₄ (active region 1 d).

A second inter-layer insulating film 15 made of a silicon oxide film is provided on the first inter-layer insulating film 14 and local wirings 3 a, 3 d.

FIG. 1C shows a cross section along B-B′ shown in FIG. 1A. The gate 2 c is provided on the element isolator 12 and the gate 2 b is provided on the active region 1 b. The first inter-layer insulating film 14 is formed at substantially the same height as the gates 2 b, 2 c. The local wiring 3 b is provided inside the first inter-layer insulating film 14. One side of the local wiring 3 b contacts one side of the gate 2 c. The bottom face of the local wiring 3 b contacts the drain D₂ (active region 1 b). That is, the local wiring 3 b connects the gate 2 c and drain D₂.

The contact 4 e is provided so as to penetrate the second inter-layer insulating film 15, first inter-layer insulating film 14 and liner film 13. The bottom face of the contact 4 e is connected to the active region 1 b. The wiring 5 e is provided on the contact 4 e.

As shown in FIG. 1B, this embodiment adopts a structure whereby the drain D₁ (active region 1 a) and drain D₂ (active region 1 b) are connected by the local wiring 3 a. That is, no contact is provided between the gate 2 a and gate 2 b for connection with a wiring in a higher layer than the local wiring 3 a.

This allows the distance t₁ between the gate 2 a and gate 2 b to be smaller than that in the conventional art. Therefore, it is possible to reduce the size of the memory cell in the short side direction. According to this embodiment, it is possible to reduce the size in the short side direction by approximately 13%.

Furthermore, as described above, a structure is adopted whereby the left end of the gate 2 c is located at a position more retreated from the gate 2 a than the left end of the active region 1 b. Moreover, a structure is adopted whereby the local wiring 3 b is disposed in a direction diagonal to the longitudinal direction of the local wiring 3 a and the drain D₂ (active region 1 b) and gate 2 c are connected.

Adopting such a structure allows the gate 2 a to be shifted rightward while keeping the distance t₂ between the gate 2 a and gate 2 c constant. That is, the gate 2 a can be shifted toward the center of the memory cell region C.

Therefore, the size of the memory cell region C in the long side direction can be reduced. According to this embodiment, the size in the long side direction can be reduced by approximately 8%.

As described above, adopting the structure shown in FIG. 1 can reduce the size of the memory cell in the short side direction by approximately 13%. Furthermore, it is possible to reduce the size of the memory cell in the long side direction by approximately 8%. Therefore, reducing sizes of the memory cell in both the short side direction and long side direction can reduce the cell area by approximately 20%.

Next, the method of manufacturing the semiconductor device shown in FIG. 1 will be explained with reference to FIG. 2 to FIG. 4. “A” in these figures shows a plane view corresponding to FIG. 1A. Furthermore, “B” and “C” in these figures show sectional views corresponding to FIGS. 1B and 1C respectively.

First, the surface of a silicon substrate is selectively etched and a trench is formed. Next, a silicon oxide film is embedded inside the trench and an element isolator is formed. Next, impurities are selectively implanted into the principal surface of the silicon substrate. As a result, as shown in FIG. 2 A, active regions 1 a, 1 d are formed in the Nch region. Furthermore, the active regions 1 b and 1 c are formed in the Pch region. The active region 1 b is separated from the active region 1 a through the element isolator and formed at a position closer to the center point E of the memory cell region C than the active region 1 a.

At this time, as shown in FIG. 2B, the active regions 1 a to 1 d are separated through the element isolator 12. Furthermore, as shown in FIG. 2C, the active region 1 b and element isolator 12 are formed on the principal plane of the silicon substrate 11.

Next, gates are formed so as to cross the active regions 1 a to 1 d shown in FIG. 2 A. Next, nickel silicide (NiSi) is formed on the surface of the gate, on the surfaces of the active regions 1 a to 1 d. As a result, the gates 2 a to 2 d are formed as shown in FIG. 3.

The gate 2 a is formed so as to cross the active region 1 a. The gate 2 b is formed so as to be separated from the gage 2 a and cross the active region 1 a and active region 1 b. The left end of the gate 2 c is opposed to the right end of the gate 2 a and formed so as to retreat from the gate 2 a more than the left end of the active region 1 b.

Next, ion-injection of impurities and thermal treatment are performed. As a result, as shown in FIG. 3 A, the drain D₁ is formed between the gate 2 a and gate 2 b in the active region 1 a. Furthermore, the drain D₂ is formed at a position in the active region 1 b contacting the side of the gate 2 b on the drain D₁ side. In other words, a drain D₂ is formed at a position of the same side of the drain D₁ toward the gate 2 b.

Next, the liner film made of a silicon nitride film is formed on the silicon substrate 11 shown in FIGS. 3B, 3C to a film thickness of approximately 30 nm. Next, the first inter-layer insulating film made of a silicon oxide film is formed to the height of the gates 2 a to 2 d or to a greater film thickness. Next, the first inter-layer insulating film and liner film are selectively etched to form grooves.

Next, a titanium nitride (TiN) film is formed as a barrier metal that covers the bottom face and the side of the grooves, and tungsten (W) is embedded in the interior thereof to form a conductive film. It is also possible to use tantalum nitride (TaN) as the above described barrier metal and embed copper (Cu) in the interior thereof to form a conductive film.

Next, the whole surface of this conductive film is etched back and the conductive film of the exterior of the grooves is removed. Here, instead of etching back, it is also possible to remove the conductive film outside the grooves through chemical mechanical polishing (hereinafter referred to as “CMP”).

As a result, as shown in FIG. 4, the local wirings 3 a to 3 d are formed in the liner film 13 and first inter-layer insulating film 14.

At this time, as shown in FIG. 4B, the local wiring 3 a connects the drain D₁ (active region 1 a) and drain D₂ (active region 1 b). For this reason, there is no need to form contacts between the gate 2 a and gate 2 b to connect a wiring in a higher layer than the local wiring 3 a. This allows the distance t₁ between the gate 2 a and gate 2 b to be reduced compared to the conventional art. Therefore, the size of the memory cell in the short side direction can be reduced.

Furthermore, as shown in FIG. 4C, the local wiring 3 b connects the drain D₂ (active region 1 b) and gate 2 c. The local wiring 3 b is disposed diagonally with respect to the longitudinal direction of the local wiring 3 a. Adopting such a structure makes it possible to shift the gate 2 a rightward while keeping the distance t₂ between the gate 2 a and gate 2 c constant. That is, the gate 2 a can be shifted toward the center of the memory cell region C.

Therefore, the size of the memory cell region C in the long side direction can be reduced.

Next, the second inter-layer insulating film made of a silicon oxide film is formed on the first inter-layer insulating film 14 and local wirings 3 a, 3 d shown in FIGS. 4B, 4C to a film thickness of approximately 300 to 400 nm. Next, the surface of this film is planarized through CMP. Next, the second inter-layer insulating film, first inter-layer insulating film 14 and liner film 13 are selectively etched to open contact holes. A barrier metal film made of TiN or the like is formed on the inner surface thereof and a conductive film such as a W film is embedded. Next, the barrier metal film, conductive film or the like formed outside the contact are removed through CMP or the like. As a result, as shown in FIG. 5, contacts 4 a, 4 b, 4 d, 4 e, 4 f, 4 g, 4 i and 4 j are formed.

Next, a conductive film made of aluminum or the like is formed on the whole surface of the second inter-layer insulating film 15 shown in FIGS. 5B, 5C. Next, this conductive film is selectively etched. As a result, as shown in FIG. 1A, wirings 5 a, 5 b, 5 d, 5 e, 5 f, 5 g, 5 i and 5 j are formed on the contacts 4 a, 4 b, 4 d, 4 e, 4 f, 4 g, 4 i and 4 j respectively.

According to the manufacturing method according to this embodiment, it is possible to reduce the size of the memory cell in the short side direction by approximately 13%. Furthermore, it is possible to reduce the size of the memory cell in the long side direction by approximately 8%. Thus, by reducing both sizes in the short side and long side directions of the memory cell, it is possible to reduce the cell area by approximately 20%.

Next, a modification example of the semiconductor device shown in this embodiment will be explained.

In the plane view of the semiconductor device shown in FIG. 1A, the local wiring 3 b is disposed so as to form a predetermined angle (approximately 45°) with respect to the longitudinal direction of the local wiring 3 a. However, the local wiring 3 b may also have an L-figured shape as shown in FIG. 6. In this case, the local wiring 3 b can also connect the local wiring 3 a and gate 2 c. Therefore, the same effect as that of this embodiment can be obtained.

Second Embodiment

A plane view of a semiconductor device according to this embodiment is shown in FIG. 7A. FIG. 7B shows a sectional view along A-A′ of FIG. 7A. FIG. 7C shows a sectional view along B-B′ of FIG. 7A. Here, differences from First Embodiment will be mainly explained.

As shown in FIG. 7B, a third inter-layer insulating film 16 made of a silicon oxide film is formed on a liner film 13. Local wirings 3 a, 3 d are provided inside the liner film 13 and third inter-layer insulating film 16. The top surface of the third inter-layer insulating film 16 and the top surfaces of the local wirings 3 a, 3 d have substantially the same height.

As shown in FIG. 7C, a shared contact 3 b is formed inside the liner film 13 and third inter-layer insulating film 16. This corresponds to the local wiring 3 b shown in First Embodiment (FIG. 1C). The top surface of the third inter-layer insulating film 16, the top surface of the shared contact 3 b and the top surface of the contact 4 e have substantially the same height.

From FIGS. 7B, 7C, the local wirings 3 a, 3 d, shared contract 3 b and contact 4 e are formed to substantially the same height. That is, these are formed of the same layer.

Other parts of the configuration are the same as those of First Embodiment and explanations thereof will be omitted.

Adopting the above described structure allows lithography for forming the local wiring 3 a, shared contact 3 b and contact 4 e to be performed with a single operation. This makes it possible to reduce the total number of mask layers and also reduce the number of the process steps.

Next, the method of manufacturing the semiconductor device shown in FIG. 7 will be explained with reference to FIG. 8.

FIG. 8 shows a plane view of the parts corresponding to those of FIG. 7A. Furthermore, FIGS. 8B, 8C are sectional views corresponding to FIGS. 7B, 7C respectively.

First, steps of forming a trench (see FIGS. 2A, 2B and 2C) to steps of forming gates 2 a to 2 d (see FIGS. 3A, 3B and 3C) will be performed using a method similar to that shown in First Embodiment. Next, as in the case of First Embodiment, a liner film is formed on the silicon substrate 11 shown in FIGS. 3B, 3C. A third inter-layer insulating film made of a silicon oxide film is formed on top of it to a film thickness of approximately 300 to 400 nm. Next, the third inter-layer insulating film and liner film are selectively etched to form grooves.

Next, a titanium nitride (TiN) film is formed as a barrier metal to cover the bottom face and side of these grooves and tungsten (W) is embedded in the interior thereof to form a conductive layer. It is also possible to use tantalum nitride (TaN) as the above described barrier metal and embed copper (Cu) in the interior thereof to form a conductive layer.

Next, this conductive layer is etched back and the conductive layer outside the grooves is removed. Here, instead of etching back, CMP may be used to remove the conductive layer outside the grooves.

As a result, as shown in FIG. 8, the local wirings 3 a, 3 d, shared contact 3 b and contact 4 e are formed inside the liner film 13 and third inter-layer insulating film 16.

According to the manufacturing method of this embodiment, local wirings, shared contact (corresponding to the local wiring 3 b of First Embodiment), and contacts are formed simultaneously. Therefore, in addition to the effects obtained in First Embodiment, the number of steps can be reduced more than First Embodiment.

After this, the metal wirings are formed in the same way as First Embodiment. As a result, the structure shown in FIG. 7 is obtained.

Third Embodiment

A plane view of a semiconductor device according to this embodiment is shown in FIG. 9A. FIG. 9B shows a sectional view along A-A′ of FIG. 9A. FIG. 9C shows a sectional view along B-B′ of FIG. 9A. Here, differences from First and Second Embodiments will be mainly explained.

As shown in FIG. 9A, a local wiring 9 a is provided between a drain D₁ (active region 1 a) and drain D₂ (active region 1 b). As shown in FIG. 9B, one side of the local wiring 9 a is connected to the active region 1 a and the other side is connected to the active region 1 b. In this way, the active region 1 a and active region 1 b are connected by the local wiring 9 a.

Other parts of the configuration are the same as those of First Embodiment and explanations thereof will be omitted.

This embodiment adopts a structure whereby grooves are formed on an element isolator between the drain D₁ and drain D₂ and local wirings are provided in the grooves.

This eliminates the necessity for providing an inter-layer insulating film to form local wirings. Therefore, it is possible to reduce the number of steps compared to First Embodiment.

Next, the method of manufacturing the semiconductor device shown in FIG. 9 will be explained with reference to FIGS. 10 to 12. “A” in these figures shows a plane view of parts corresponding to those in FIG. 9A. Furthermore, “B” and “C” in these figures are sectional views corresponding to FIGS. 9B and 9C respectively.

First, steps of forming a trench and steps of forming the active regions 1 a to 1 d (see FIGS. 2A, 2B and 2C) will be performed using a method similar to that shown in First Embodiment.

Next, grooves are formed by selectively etching the surface of an element isolator 12 between the active region 1 a and active region 1 b shown in FIG. 2B to a depth of approximately 30 nm from the top surface. Next, a silicon film is formed over the whole surface so as to fill the interior of the grooves. Next, impurities are ion-injected into the silicon film. Next, the silicon film is etched back and the silicon film outside the grooves is removed. As a result, as shown in FIG. 10B, a wiring 9 a connecting the active region 1 a and active region 1 b is formed in the groove on the element isolator 12.

Next, gates are formed on the silicon substrate 11 shown in FIGS. 10B, 10C. As a result, the structure shown in FIG. 11 is obtained.

A gate 2 a which is separated from the wiring 9 a and which crosses the active region 1 a is formed. Separated from the gate 2 a and wiring 9 a, a gate 2 b is formed opposite the gate 2 a with the wiring 9 a placed in between. The gate 2 b crosses the active region 1 a and active region 1 b. Separated from the gate 2 a, gate 2 b and wiring 9 a, a gate 2 c is formed. The left end thereof is opposed to the right end of the gate 2 a and retreated from the gate 2 a more than the left end of the active region 1 b.

Next, ion-injection of impurities and thermal treatment are performed. As a result, as shown in FIG. 12A, the drain D₁ is formed between the gate 2 a and gate 2 b in the active region 1 a. Furthermore, the drain D₂ is formed in the active region 1 b on the drain D₁ side of the gate 2 b.

Next, a liner film made of a silicon nitride film is formed on the silicon substrate 11 shown in FIGS. 11B, 11C to a film thickness of approximately 30 nm. Next, a third inter-layer insulating film made of a silicon oxide film is formed on the liner film to a film thickness of approximately 300 to 400 nm. Next, the third inter-layer insulating film and liner film are selectively etched and to form grooves.

Next, a titanium nitride (TiN) film is formed as a barrier metal that covers the bottom face and the side of these grooves and tungsten (W) is embedded in the interior thereof to form a conductive film. It is also possible to use tantalum nitride (TaN) as the above described barrier metal and copper (Cu) is embedded in the interior thereof to form a conductive film.

Next, this conductive film is etched back and the conductive film outside the grooves is removed. Here, it is also possible to use CMP to remove the conductive film outside the grooves instead of etching back.

As a result, as shown in FIG. 12C, the shared contact 3 b and contact 4 e are formed inside the liner film 13 and third inter-layer insulating film 16.

Next, metal wirings are formed on the contact 4 e in the same way as First Embodiment. As a result, the structure shown in FIG. 9 is obtained.

The manufacturing method according to this embodiment eliminates the necessity for providing inter-layer insulating films to form local wirings. Thus, compared to First Embodiment, it is possible to reduce the number of steps.

Fourth Embodiment

FIG. 13A shows a plane view of a semiconductor device according to this embodiment. FIG. 13B shows a sectional view along A-A′ of FIG. 13A. FIG. 13C shows a sectional view along B-B′ of FIG. 13A. Here, differences from First to Third Embodiments will be mainly explained.

As shown in FIG. 13B, a first inter-layer insulating film 14 made of a silicon oxide film is formed on a liner film 13. A fourth inter-layer insulating film 17 and fifth inter-layer insulating film 18 made of a silicon oxide film are laminated thereon. Local wirings 3 a, 3 d are provided inside the liner film 13 and first inter-layer insulating film 14. The top surface of the first inter-layer insulating film 14 and the top surfaces of the local wirings 3 a, 3 d have substantially the same height.

As shown in FIG. 13C, a shared contact 3 b is formed inside the liner film 13, first inter-layer insulating film 14 and fourth inter-layer insulating film 17. The top surface of the shared contact 3 b and the top surface of the fourth inter-layer insulating film 17 have substantially the same height. A contact 4 e is provided inside the liner film 13, first inter-layer insulating film 14, fourth inter-layer insulating film 17 and fifth inter-layer insulating film 18. The top surface of the contact 4 e and the top surface of the fifth inter-layer insulating film 18 have substantially the same height.

From FIGS. 13B, 13C, the local wiring 3 a, shared contact 3 b and contact 4 e have different heights. That is, these are formed of different layers.

Other parts of the configuration are the same as those of Second Embodiment and explanations thereof will be omitted.

The shared contact 3 b and contact 4 e in the above described structure have different heights from the silicon substrate 11. That is, these contacts are formed in different etching steps.

This allows an over etching time to be optimized in the respective etching steps. Therefore, it is possible to facilitate steps of forming the respective contacts.

Next, the method of manufacturing the semiconductor device shown in FIG. 13 will be explained with reference to FIGS. 14 to 16.

“A” in these figures shows a plane view of parts corresponding to FIG. 13A. Furthermore, “B” and “C” in these figures show sectional views of parts corresponding to those in FIGS. 13B and 13C respectively.

First, steps of forming a trench (see FIGS. 2A, 2B and 2C) to steps of forming gates 2 a to 2 d (see FIGS. 3A, 3B and 3C) will be performed using a method similar to that shown in First Embodiment. Next, a liner film is formed on the silicon substrate 11 shown in FIGS. 3B, 3C.

Next, the first inter-layer insulating film made of a silicon oxide film is formed on the liner film to the height of the gates 2 a to 2 d or a greater film thickness. Next, the first inter-layer insulating film and liner film are selectively etched to form grooves.

Next, a titanium nitride (TiN) film is formed as a barrier metal to cover the bottom face and side of these grooves and tungsten (W) is embedded in the interior thereof to form a conductive layer. It is also possible to use tantalum nitride (TaN) as the above described barrier metal and embed copper (Cu) in the interior thereof to form a conductive layer.

Next, this conductive layer is etched back and the conductive layer outside the grooves is removed. Here, instead of etching back, CMP may be used to remove the conductive layer outside the grooves.

As a result, as shown in FIG. 14B, the local wirings 3 a, 3 d are formed inside the liner film 13 and first inter-layer insulating film 14.

Next, the fourth inter-layer insulating film made of a silicon oxide film is formed on the first inter-layer insulating film 14, local wirings 3 a, 3 d shown in FIG. 14B to a film thickness of approximately 100 to 200 nm. Next, the fourth inter-layer insulating film, first inter-layer insulating film 14 and liner film 13 are selectively etched to form grooves. A metal film such as a W film is embedded in the inner surface thereof. Next, the metal film formed outside the grooves is removed through CMP or the like. As a result, as shown in FIG. 15B, the shared contact 3 b is formed inside the liner film 13, first inter-layer insulating film 14 and fourth inter-layer insulating film 17.

Next, the fifth inter-layer insulating film made of a silicon oxide film is formed on the fourth inter-layer insulating film 17 shown in FIGS. 15B, 15C to a film thickness of approximately 200 to 300 nm. Next, the surface of this film is planarized through CMP. Next, the fifth inter-layer insulating film, fourth inter-layer insulating film 17, first inter-layer insulating film 14 and liner film 13 are selectively etched to open contact holes. A barrier metal film such as a TiN film is formed on the inner surface thereof and a conductive film such as a W film is further embedded. Next, the barrier metal film outside the contact holes and conductive film are removed through CMP or the like. As a result, as shown in FIG. 16, contacts 4 a, 4 b, 4 d, 4 e, 4 f, 4 g, 4 i and 4 j are formed.

According to this embodiment, when the local wiring 3 a, shared contact 3 b and contact 4 e are formed, the etching steps of forming the respective grooves (or hole patterns) can be performed separately. This allows the over etching time to be optimized in the respective etching steps.

After this, the metal wirings are formed in the same way as First Embodiment. As a result, the structure shown in FIG. 13 is obtained.

Using the above described manufacturing method, when forming the local wirings, shared contacts and contacts, it is possible to optimize the over etching time in the etching steps of forming the respective grooves (or hole patterns).

Obviously many modifications and variations of the present invention are possible in the light of the above teachings. It is therefore to be understood that within the scope of the appended claims the invention may by practiced otherwise than as specifically described.

The entire disclosure of a Japanese Patent Application No. 2005-295258, filed on Oct. 7, 2005 including specification, claims, drawings and summary, on which the Convention priority of the present application is based, are incorporated herein by reference in its entirety. 

1-11. (canceled)
 12. A method of manufacturing a semiconductor device, comprising the steps of: (a) preparing a substrate; (b) forming a first active region in the substrate and forming a second active region, which is separated from the first active region, in the substrate; (c) forming a first gate electrode region which is crossed by the first active region, and separated from the second active region, and forming a second gate electrode region which is crossed by the first active region and the second active region, and separated from the first gate electrode region, and forming a third gate electrode region which is separated from the first active region, the first gate electrode region and the second gate electrode region; (d) after step (a) to (c), forming an insulating film, which is separated from a top of the first gate electrode region, a top of the second gate electrode region and a top of the third gate electrode region, over the substrate; (e) after step (d), etching the insulating film and the third gate electrode region so as to form a groove on the third gate electrode region, on the first active region, on the second active region and over a region between the first active region and the second active region; (f) after step (a) to (e), forming a conductive film over the substrate; and (g) after step (f), removing the conductive film out of the groove, reaching the top of the first gate electrode region, the top of the second gate electrode region and the top of the third gate electrode region and forming a wiring which connects the first active region, the second active region and the third gate electrode region.
 13. A method of manufacturing a semiconductor device according to claim 1, wherein the first active region and the second active region are extended in the first direction, and the first gate electrode region, the second gate electrode region and the third gate electrode region are extended in the second direction which is different direction from the first direction.
 14. A method of manufacturing a semiconductor device according to claim 2, wherein the first active region, the second active region, the first gate electrode region, second gate electrode region and the third gate electrode region are formed in a memory cell in the substrate, a center of the memory cell region is extended in the first direction, the first active region is formed next to the second active region, and the second active region is closer to the center of the memory cell than the first active region.
 15. A method of manufacturing a semiconductor device according to claim 3, wherein the second gate electrode region and the third gate electrode region are crossed by the center of the memory cell region, and the first gate electrode region is separated from the center of the memory cell.
 16. A method of manufacturing a semiconductor device according to claim 4, wherein the first direction and the second direction orthogonally cross.
 17. A method of manufacturing a semiconductor device, comprising the steps of: (a) preparing a substrate; (b) forming a first active region in the substrate and forming a second active region, which is separated from the first active region, in the substrate; (c) forming a gate electrode region which is separated from the first active region; (d) after step (a) to (c), forming an insulating film, which is separated from a top of the first gate electrode region, over the substrate; (e) after step (d), etching the insulating film and the gate electrode region so as to form a groove on the gate electrode region, on the first active region, on the second active region and over a region between the first active region and the second active region; (f) after step (a) to (e), forming a conductive film over the substrate, and (g) after step (f), removing the conductive film out of the groove, reaching the top of the gate electrode region and forming a wiring which connects the first active region, the second active region and the gate electrode region. 